Invention Grant
- Patent Title: System and method using x-rays for depth-resolving metrology and analysis
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Application No.: US17476355Application Date: 2021-09-15
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Publication No.: US11549895B2Publication Date: 2023-01-10
- Inventor: Wenbing Yun , Benjamin Donald Stripe , Janos Kirz , Sylvia Jia Yun Lewis
- Applicant: Sigray, Inc.
- Applicant Address: US CA Concord
- Assignee: Sigray, Inc.
- Current Assignee: Sigray, Inc.
- Current Assignee Address: US CA Concord
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: G01N23/20
- IPC: G01N23/20 ; G01N23/223 ; G01N23/2273 ; G01N23/2206

Abstract:
A system and method for analyzing a three-dimensional structure of a sample includes generating a first x-ray beam having a first energy bandwidth less than 20 eV at full-width-at-half maximum and a first mean x-ray energy that is in a range of 1 eV to 1 keV higher than an absorption edge energy of a first atomic element of interest, and that is collimated to have a collimation angular range less than 7 mrad in at least one direction perpendicular to a propagation direction of the first x-ray beam; irradiating the sample with the first x-ray beam at a plurality of incidence angles relative to a substantially flat surface of the sample, the incidence angles of the plurality of incidence angles in a range of 3 mrad to 400 mrad; and simultaneously detecting a reflected portion of the first x-ray beam from the sample and detecting x-ray fluorescence x-rays and/or photoelectrons from the sample.
Public/Granted literature
- US20220082515A1 SYSTEM AND METHOD USING X-RAYS FOR DEPTH-RESOLVING METROLOGY AND ANALYSIS Public/Granted day:2022-03-17
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