Invention Grant
- Patent Title: Group III-nitride devices with improved RF performance and their methods of fabrication
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Application No.: US16643923Application Date: 2017-09-30
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Publication No.: US11557667B2Publication Date: 2023-01-17
- Inventor: Marko Radosavljevic , Sansaptak Dasgupta , Han Wui Then , Ibrahim Ban , Paul B. Fischer
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP
- International Application: PCT/US2017/054679 WO 20170930
- International Announcement: WO2019/066995 WO 20190404
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66 ; H01L21/02 ; H01L21/306 ; H01L21/762 ; H01L29/08 ; H01L29/20 ; H01L29/205 ; H01L29/51

Abstract:
A device including a III-N material is described. The device includes a transistor structure having a first layer including a first group III-nitride (III-N) material, a polarization charge inducing layer above the first layer, the polarization charge inducing layer including a second III-N material, a gate electrode above the polarization charge inducing layer and a source structure and a drain structure on opposite sides of the gate electrode. The device further includes a plurality of peripheral structures adjacent to transistor structure, where each of the peripheral structure includes the first layer, but lacks the polarization charge inducing layer, an insulating layer above the peripheral structure and the transistor structure, wherein the insulating layer includes a first dielectric material. A metallization structure, above the peripheral structure, is coupled to the transistor structure.
Public/Granted literature
- US20200212211A1 GROUP III-NITRIDE DEVICES WITH IMPROVED RF PERFORMANCE AND THEIR METHODS OF FABRICATION Public/Granted day:2020-07-02
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