Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US17070951Application Date: 2020-10-15
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Publication No.: US11569086B2Publication Date: 2023-01-31
- Inventor: Kazuki Kosai , Kazuyoshi Shinohara
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- Priority: JPJP2019-199988 20191101
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C11D7/08 ; H01L21/67 ; B08B3/04

Abstract:
A substrate processing apparatus includes a substrate processing part that supplies a processing liquid from a processing liquid supply part to a mounted substrate to execute liquid processing, a liquid drainage part that has a recovery channel connected to a storage part that stores the processing liquid and drains the processing liquid used for the liquid processing, and a control unit executes a processing recipe for the liquid processing and a cleaning recipe for cleaning the substrate processing part and the liquid drainage part. The control unit executes a cleaning operation for supplying a cleaning liquid from a cleaning liquid supply part to clean the substrate processing part and the liquid drainage part and subsequently executes a return operation for supplying the processing liquid from the processing liquid supply part to replace the cleaning liquid attached to the substrate processing part and the liquid drainage part with the processing liquid.
Public/Granted literature
- US20210134590A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2021-05-06
Information query
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