Invention Grant
- Patent Title: Film forming method and film forming apparatus
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Application No.: US17132656Application Date: 2020-12-23
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Publication No.: US11587787B2Publication Date: 2023-02-21
- Inventor: Yoshihiro Takezawa , Daisuke Suzuki , Hiroyuki Hayashi , Yutaka Motoyama
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2019-236788 20191226
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/3065 ; H01L21/306
Abstract:
A film forming method includes: forming a laminated film, in which an interface layer, a bulk layer, and a surface layer are laminated in this order, on a base; and crystallizing the laminated film, wherein the bulk layer is formed of a film that is easier to crystallize than the interface layer in crystallizing the laminated film, and wherein the surface layer is formed of a film that is easier to crystallize than the bulk layer in crystallizing the laminated film.
Public/Granted literature
- US20210202248A1 FILM FORMING METHOD AND FILM FORMING APPARATUS Public/Granted day:2021-07-01
Information query
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