- 专利标题: Self-aligned contacts
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申请号: US17147423申请日: 2021-01-12
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公开(公告)号: US11600524B2公开(公告)日: 2023-03-07
- 发明人: Mark T. Bohr , Tahir Ghani , Nadia M. Rahhal-Orabi , Subhash M. Joshi , Joseph M. Steigerwald , Jason W. Klaus , Jack Hwang , Ryan Mackiewicz
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: H01L21/768
- IPC分类号: H01L21/768 ; H01L29/78 ; H01L29/49 ; H01L29/66 ; H01L29/51 ; H01L21/28 ; H01L21/283 ; H01L21/311 ; H01L23/522 ; H01L23/528 ; H01L29/08 ; H01L29/423 ; H01L29/16 ; H01L29/45 ; H01L21/285 ; H01L23/535
摘要:
A transistor comprises a substrate, a pair of spacers on the substrate, a gate dielectric layer on the substrate and between the pair of spacers, a gate electrode layer on the gate dielectric layer and between the pair of spacers, an insulating cap layer on the gate electrode layer and between the pair of spacers, and a pair of diffusion regions adjacent to the pair of spacers. The insulating cap layer forms an etch stop structure that is self aligned to the gate and prevents the contact etch from exposing the gate electrode, thereby preventing a short between the gate and contact. The insulator-cap layer enables self-aligned contacts, allowing initial patterning of wider contacts that are more robust to patterning limitations.
公开/授权文献
- US20210134673A1 SELF-ALIGNED CONTACTS 公开/授权日:2021-05-06
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