Invention Grant
- Patent Title: Electrostatic chuck with embossments that comprise diamond-like carbon and deposited silicon-based material, and related methods
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Application No.: US17459272Application Date: 2021-08-27
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Publication No.: US11612972B2Publication Date: 2023-03-28
- Inventor: Yan Liu , Steven Donnell , Jakub Rybczynski , Chun Wang Chan , Caleb Minsky
- Applicant: ENTEGRIS, INC.
- Applicant Address: US MA Billerica
- Assignee: ENTEGRIS, INC.
- Current Assignee: ENTEGRIS, INC.
- Current Assignee Address: US MA Billerica
- Main IPC: H01T23/00
- IPC: H01T23/00 ; B23Q3/15 ; H01L21/683 ; B23K1/19 ; H01L21/687 ; B23K1/00 ; B23K103/00
Abstract:
Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, the electrostatic chuck including embossments that are made of multiple deposited layers, the layers including diamond-like carbon layers and layers that contain silicon-based materials such as silicon carbide layers.
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