公开(公告)号：US11837492B2

公开(公告)日：2023-12-05

申请号：US17317585

申请日：2021-05-11

Applicant: ENTEGRIS, INC.

Inventor： Yan Liu ,  Jakub Rybczynski ,  Steven Donnell ,  Caleb Minsky ,  Chun Wang Chan

IPC: H01T23/00 ,  H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/67248

Abstract: Described are electrostatic chucks designed for use in supporting a workpiece during a workpiece processing step, the electrostatic chuck including a gas flow system.

公开(公告)号：US20230274967A1

公开(公告)日：2023-08-31

申请号：US18113941

申请日：2023-02-24

Applicant: ENTEGRIS, INC.

Inventor： Jakub Rybczynski ,  Steven Donnell ,  Yan Liu ,  Caleb Minsky ,  Chandra Venkatraman ,  Carlo Waldfried

IPC: H01L21/683

CPC classification number: H01L21/6833

Abstract: Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, the electrostatic chuck including a pattern of charge dissipation lines on an insulating layer, the lines having a first conductive layer and a second conductive layer and being arranged to define enclosed fields of the insulating layer between the lines.

公开(公告)号：US20230136703A1

公开(公告)日：2023-05-04

申请号：US17974019

申请日：2022-10-26

Applicant: ENTEGRIS, INC.

Inventor： Yan Liu ,  Jakub Rybczynski ,  Caleb Minsky ,  Steven Donnell

IPC: H01L21/683 ,  C23C16/40 ,  C23C16/455

Abstract: Described are electrostatic chuck devices that are useful to support a workpiece while processing the workpiece, upper ceramic layer components of electrostatic chuck assemblies, the upper ceramic layer having a deposited dielectric layer, a relatively smooth finish, or both, and related methods.

公开(公告)号：US11612972B2

公开(公告)日：2023-03-28

申请号：US17459272

申请日：2021-08-27

Applicant: ENTEGRIS, INC.

Inventor： Yan Liu ,  Steven Donnell ,  Jakub Rybczynski ,  Chun Wang Chan ,  Caleb Minsky

IPC: H01T23/00 ,  B23Q3/15 ,  H01L21/683 ,  B23K1/19 ,  H01L21/687 ,  B23K1/00 ,  B23K103/00

Abstract: Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, the electrostatic chuck including embossments that are made of multiple deposited layers, the layers including diamond-like carbon layers and layers that contain silicon-based materials such as silicon carbide layers.