Invention Grant
- Patent Title: Semiconductor device structure with uneven gate profile
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Application No.: US17301431Application Date: 2021-04-02
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Publication No.: US11631745B2Publication Date: 2023-04-18
- Inventor: Chi-Sheng Lai , Yu-Fan Peng , Li-Ting Chen , Yu-Shan Lu , Yu-Bey Wu , Wei-Chung Sun , Yuan-Ching Peng , Kuei-Yu Kao , Shih-Yao Lin , Chih-Han Lin , Pei-Yi Liu , Jing Yi Yan
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L27/092 ; H01L29/78 ; H01L29/66 ; H01L21/8238 ; H01L29/40 ; H01L29/06 ; H01L29/786

Abstract:
A semiconductor structure includes a semiconductor substrate; fin active regions protruded above the semiconductor substrate; and a gate stack disposed on the fin active regions; wherein the gate stack includes a high-k dielectric material layer, and various metal layers disposed on the high-k dielectric material layer. The gate stack has an uneven profile in a sectional view with a first dimension D1 at a top surface, a second dimension D2 at a bottom surface, and a third dimension D3 at a location between the top surface and the bottom surface, and wherein each of D1 and D2 is greater than D3.
Public/Granted literature
- US20210359095A1 Semiconductor Device Structure with Uneven Gate Profile Public/Granted day:2021-11-18
Information query
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