Invention Grant
- Patent Title: Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device
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Application No.: US16807496Application Date: 2020-03-03
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Publication No.: US11650501B2Publication Date: 2023-05-16
- Inventor: Tsutomu Yoshimura , Yasunori Yonekuta , Naoya Hatakeyama , Kohei Higashi , Yoichi Nishida
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 2017176147 2017.09.13 JP 2018015424 2018.01.31
- Main IPC: G03F7/039
- IPC: G03F7/039 ; C08F220/18 ; C08F212/14 ; C08F212/08 ; G03F7/004 ; G03F7/038 ; C07C381/12
Abstract:
Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A),
in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group,
a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A),
a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A),
a glass transition temperature of the resin (A) is 145° C. or lower, and
the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 μm or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group,
a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A),
a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A),
a glass transition temperature of the resin (A) is 145° C. or lower, and
the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 μm or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
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