公开(公告)号：US11687001B2

公开(公告)日：2023-06-27

申请号：US16807496

申请日：2020-03-03

Applicant: FUJIFILM Corporation

Inventor： Tsutomu Yoshimura ,  Yasunori Yonekuta ,  Naoya Hatakeyama ,  Kohei Higashi ,  Yoichi Nishida

IPC: G03F7/039 ,  C08F220/18 ,  C08F212/14 ,  C08F212/08 ,  G03F7/004 ,  G03F7/038 ,  C07C381/12

CPC classification number: G03F7/039 ,  C07C381/12 ,  C08F212/08 ,  C08F212/24 ,  C08F212/30 ,  C08F220/1804 ,  C08F220/1809 ,  G03F7/0045 ,  G03F7/038

Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A),



in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group,
a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A),
a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A),
a glass transition temperature of the resin (A) is 145° C. or lower, and
the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 μm or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.

公开(公告)号：US11835849B2

公开(公告)日：2023-12-05

申请号：US18109399

申请日：2023-02-14

Applicant: FUJIFILM Corporation

Inventor： Tsutomu Yoshimura ,  Yasunori Yonekuta ,  Naoya Hatakeyama ,  Kohei Higashi ,  Yoichi Nishida

IPC: G03F7/039 ,  C08F220/18 ,  C08F212/14 ,  C08F212/08 ,  G03F7/004 ,  G03F7/038 ,  C07C381/12

CPC classification number: G03F7/039 ,  C07C381/12 ,  C08F212/08 ,  C08F212/24 ,  C08F212/30 ,  C08F220/1804 ,  C08F220/1809 ,  G03F7/0045 ,  G03F7/038

Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A),



in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group,
a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A),
a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A),
a glass transition temperature of the resin (A) is 145° C. or lower, and
the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 μm or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.

公开(公告)号：US11650501B2

公开(公告)日：2023-05-16

申请号：US16807496

申请日：2020-03-03

Applicant: FUJIFILM Corporation

Inventor： Tsutomu Yoshimura ,  Yasunori Yonekuta ,  Naoya Hatakeyama ,  Kohei Higashi ,  Yoichi Nishida

IPC: G03F7/039 ,  C08F220/18 ,  C08F212/14 ,  C08F212/08 ,  G03F7/004 ,  G03F7/038 ,  C07C381/12

CPC classification number: G03F7/039 ,  C07C381/12 ,  C08F212/08 ,  C08F212/24 ,  C08F212/30 ,  C08F220/1804 ,  C08F220/1809 ,  G03F7/0045 ,  G03F7/038

Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A),



in which the resin (A) includes a repeating unit having an acidic group and a repeating unit having an acid-decomposable group,
a content of the repeating unit having an acidic group is 15% by mole or more with respect to all the repeating units in the resin (A),
a content of the repeating unit having an acid-decomposable group is more than 20% by mole with respect to all the repeating units in the resin (A),
a glass transition temperature of the resin (A) is 145° C. or lower, and
the actinic ray-sensitive or radiation-sensitive resin composition is used for formation of a film having a film thickness of 2 μm or more; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.