Invention Grant
- Patent Title: Multiple uplink port devices
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Application No.: US17153751Application Date: 2021-01-20
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Publication No.: US11657015B2Publication Date: 2023-05-23
- Inventor: Debendra Das Sharma , Anil Vasudevan , David Harriman
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alliance IP, LLC
- Main IPC: G06F13/16
- IPC: G06F13/16 ; G06F13/42 ; G06F13/40

Abstract:
A device is provided with two or more uplink ports to connect the device via two or more links to one or more sockets, where each of the sockets includes one or more processing cores, and each of the two or more links is compliant with a particular interconnect protocol. The device further includes I/O logic to identify data to be sent to the one or more processing cores for processing, determine an affinity attribute associated with the data, and determine which of the two or more links to use to send the data to the one or more processing cores based on the affinity attribute.
Public/Granted literature
- US20210165756A1 MULTIPLE UPLINK PORT DEVICES Public/Granted day:2021-06-03
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