Invention Grant
- Patent Title: Hybrid system architecture for thin film deposition
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Application No.: US16716173Application Date: 2019-12-16
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Publication No.: US11694913B2Publication Date: 2023-07-04
- Inventor: Terry Bluck
- Applicant: Intevac, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: INTEVAC, INC.
- Current Assignee: INTEVAC, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Womble Bond Dickinson (US) LLP
- Agent Joseph Bach, Esq.
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; C23C14/35 ; H01L21/683 ; C23C14/56

Abstract:
A processing system is provided, including a vacuum enclosure having a plurality of process windows and a continuous track positioned therein; a plurality of processing chambers attached sidewalls of the vacuum enclosures, each processing chamber about one of the process windows; a loadlock attached at one end of the vacuum enclosure and having a loading track positioned therein; at least one gate valve separating the loadlock from the vacuum enclosure; a plurality of substrate carriers configured to travel on the continuous track and the loading track; at least one track exchanger positioned within the vacuum enclosure, the track exchangers movable between a first position, wherein substrate carriers are made to continuously move on the continuous track, and a second position wherein the substrate carriers are made to transfer between the continuous track and the loading track.
Information query
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