Invention Grant
- Patent Title: Methods for printing solder paste and other viscous materials at high resolution
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Application No.: US17818308Application Date: 2022-08-08
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Publication No.: US11697166B2Publication Date: 2023-07-11
- Inventor: Michael Zenou , Ziv Gilan , Guy Nesher
- Applicant: IO Tech Group Ltd.
- Applicant Address: GB London
- Assignee: IO TECH GROUP LTD.
- Current Assignee: IO TECH GROUP LTD.
- Current Assignee Address: IL Modiin
- Agency: Ascenda Law Group, PC
- The original application number of the division: US16807489 2020.03.03
- Main IPC: B05D1/26
- IPC: B05D1/26 ; B23K1/00 ; H05K3/34 ; B41M3/00 ; B41F16/00 ; B05D3/06 ; B05D1/28 ; B05C5/02 ; B05C1/08 ; B05C9/14 ; B23K101/42 ; H05K3/00

Abstract:
Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.
Public/Granted literature
- US20220379396A1 METHODS FOR PRINTING SOLDER PASTE AND OTHER VISCOUS MATERIALS AT HIGH RESOLUTION Public/Granted day:2022-12-01
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