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    PCB production by laser systems
    1.
    发明授权
    PCB production by laser systems 有权

    公开(公告)号：US12089328B2

    公开(公告)日：2024-09-10

    申请号：US18499009

    申请日：2023-10-31

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Guy Nesher

    IPC: H05K1/11 ,  H05K3/34 ,  H05K13/04

    CPC classification number: H05K1/111 ,  H05K3/341 ,  H05K13/046 ,  H05K2201/10666

    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCB s produced according to the present systems and methods may be single-sided or double-sided.

    Systems for surface mounting electronic components on a printed circuit board
    3.
    发明授权
    Systems for surface mounting electronic components on a printed circuit board 有权

    公开(公告)号：US12010800B2

    公开(公告)日：2024-06-11

    申请号：US17305108

    申请日：2021-06-30

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Ziv Gilan ,  Guy Nesher

    IPC: H05K13/04 ,  B65G47/91 ,  H05K3/30 ,  H05K13/08

    CPC classification number: H05K13/0409 ,  B65G47/91 ,  H05K3/301 ,  H05K13/0812 ,  Y10T29/53174

    Abstract: In a first approach, a vacuum cell comprises a porous plate and a vacuum force generated by gas being drawn thorough the porous plate is used to pick electronic components from a donor substrate. After transport of the vacuum cell to a placing area, dots of liquid material may be deposited on a top surface of the porous plate adjacent to one or more picked components in order to disrupt the vacuum force and release the picked components onto a receiving substrate. In a refinement of the first approach, the porous plate contains a plurality of picking holes for selectively picking components. Certain picking holes can be fluidly coupled to the vacuum, allowing components to be attached within those picking holes, while other picking holes can be closed or rendered inactive with dots of liquid material deposited on a top surface of the porous plate.

    PCB PRODUCTION BY LASER SYSTEMS
    4.
    发明公开
    PCB PRODUCTION BY LASER SYSTEMS 审中-公开

    公开(公告)号：US20240064897A1

    公开(公告)日：2024-02-22

    申请号：US18499009

    申请日：2023-10-31

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou ,  Guy Nesher

    IPC: H05K1/11 ,  H05K13/04 ,  H05K3/34

    CPC classification number: H05K1/111 ,  H05K13/046 ,  H05K3/341 ,  H05K2201/10666

    Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4) or others. The jet printing unit can also be used for sintering and/or ablation of materials. Printed materials are cured by heating or by infrared (IR) or ultraviolet (UV) radiation. PCB s produced according to the present systems and methods may be single-sided or double-sided.

    SYSTEMS FOR PRINTING CONFORMAL MATERIALS ON COMPONENT EDGES AT HIGH RESOLUTION
    10.
    发明申请
    SYSTEMS FOR PRINTING CONFORMAL MATERIALS ON COMPONENT EDGES AT HIGH RESOLUTION 有权

    公开(公告)号：US20230007786A1

    公开(公告)日：2023-01-05

    申请号：US17931331

    申请日：2022-09-12

    Applicant: IO Tech Group Ltd.

    Inventor： Michael Zenou

    IPC: H05K3/28 ,  H05K3/00

    Abstract: Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.

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