Invention Grant
- Patent Title: Apparatus for conducting plasma surface treatment, board treatment system having the same
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Application No.: US16883392Application Date: 2020-05-26
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Publication No.: US11728142B2Publication Date: 2023-08-15
- Inventor: Junyoung Oh , Jaeho Kwak , Boeun Jang , Seokyeon Hwang , Yongseok Seo , Sangsoo Kim , Seunghwan Kim , Jongho Park , Yongkwan Lee , Jongho Lee , Daewook Kim , Wonpil Lee , Changkyu Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,New Power Plasma CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,New Power Plasma CO., LTD.
- Current Assignee Address: KR Suwon-si; KR Pyeongtaek-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20190106335 2019.08.29
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C16/455 ; C23C16/458 ; H01L21/673

Abstract:
A surface treatment apparatus and a surface treatment system having the same are disclosed. The surface treatment apparatus includes a process chamber in which the surface treatment process is conducted, a plasma generator for generating process radicals as a plasma state for the surface treatment process, the plasma generator being positioned outside of the process chamber and connected to the process chamber by a supply duct, a heat exchanger arranged on the supply duct and cooling down temperature of the process radicals passing through the supply duct and a flow controller controlling the process radicals to flow out of the process chamber. The flow controller is connected to a discharge duct through which the process radicals are discharged outside the process chamber. The plasma surface treatment process is conducted to the package structure having minute mounting gap without the damages to the IC chip and the board.
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