Invention Grant
- Patent Title: Thermal dissipation in dual-chassis devices
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Application No.: US17560719Application Date: 2021-12-23
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Publication No.: US11755080B2Publication Date: 2023-09-12
- Inventor: Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Raghavendra Doddi , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: G06F1/20
- IPC: G06F1/20 ; G06F1/16 ; H05K7/20 ; G06F3/041 ; H04M1/02

Abstract:
There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
Public/Granted literature
- US20220113759A1 THERMAL DISSIPATION IN DUAL-CHASSIS DEVICES Public/Granted day:2022-04-14
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