- 专利标题: Thermal dissipation in dual-chassis devices
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申请号: US17560719申请日: 2021-12-23
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公开(公告)号: US11755080B2公开(公告)日: 2023-09-12
- 发明人: Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Raghavendra Doddi , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Patent Capital Group
- 主分类号: G06F1/20
- IPC分类号: G06F1/20 ; G06F1/16 ; H05K7/20 ; G06F3/041 ; H04M1/02
摘要:
There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
公开/授权文献
- US20220113759A1 THERMAL DISSIPATION IN DUAL-CHASSIS DEVICES 公开/授权日:2022-04-14
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