公开(公告)号：USD788778S1

公开(公告)日：2017-06-06

申请号：US29534960

申请日：2015-08-03

申请人： Intel Corporation

设计人： Aleksander Magi ,  Krishnakumar Varadarajan ,  Gopinath Kandasamy ,  Nicholas W. Oakley

公开(公告)号：US11755080B2

公开(公告)日：2023-09-12

申请号：US17560719

申请日：2021-12-23

申请人： Intel Corporation

发明人： Prakash Kurma Raju ,  Babu Triplicane Gopikrishnan ,  Bijendra Singh ,  Prasanna Pichumani ,  Raghavendra Doddi ,  Harish Jagadish ,  Gopinath Kandasamy ,  David Pidwerbecki

IPC分类号： G06F1/20 ,  G06F1/16 ,  H05K7/20 ,  G06F3/041 ,  H04M1/02

CPC分类号： G06F1/203 ,  G06F1/1616 ,  G06F1/1637 ,  G06F1/1647 ,  G06F1/1681 ,  H04M1/022 ,  H05K7/2039 ,  G06F3/041 ,  G06F2200/203 ,  H04M1/0216 ,  H04M2250/16

摘要： There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.

公开(公告)号：US20220113759A1

公开(公告)日：2022-04-14

申请号：US17560719

申请日：2021-12-23

申请人： Intel Corporation

发明人： Prakash Kurma Raju ,  Babu Triplicane Gopikrishnan ,  Bijendra Singh ,  Prasanna Pichumani ,  Raghavendra Doddi ,  Harish Jagadish ,  Gopinath Kandasamy ,  David Pidwerbecki

IPC分类号： G06F1/16 ,  G06F1/20 ,  H05K7/20

摘要： There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.

公开(公告)号：US11551891B2

公开(公告)日：2023-01-10

申请号：US16455576

申请日：2019-06-27

申请人： Intel Corporation

发明人： Prakash Kurma Raju ,  Raghavendra Doddi ,  Prasanna Pichumani ,  Sachin Bedare ,  Bijendra Singh ,  Gopinath Kandasamy

IPC分类号： H01H13/84 ,  H01H13/705 ,  G06F1/16

摘要： Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.

公开(公告)号：US20210112679A1

公开(公告)日：2021-04-15

申请号：US17130689

申请日：2020-12-22

申请人： Intel Corporation

发明人： Baomin Liu ,  Rob W. Sims ,  Kannan G. Raja ,  Linden H. McClure ,  Gopinath Kandasamy

IPC分类号： H05K7/20

摘要： Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a plurality of heat sources on the substrate, a heat spreader that extends over the plurality of heat sources, and a plurality of heat spreader mounting brackets. Each of the plurality of heat spreader mounting brackets are over a corresponding heat source from the plurality of heat sources and the plurality of heat spreaders secure the heat spreader to the substrate without extending through the heat spreader. In some examples, the heat spreader is a vapor chamber and the plurality of heat spreader mounting brackets are soldered to the vapor chamber.

公开(公告)号：US11231757B2

公开(公告)日：2022-01-25

申请号：US16052590

申请日：2018-08-01

申请人： Intel Corporation

发明人： Prakash Kurma Raju ,  Babu Triplicane Gopikrishnan ,  Bijendra Singh ,  Prasanna Pichumani ,  Raghavendra Doddi ,  Harish Jagadish ,  Gopinath Kandasamy ,  David Pidwerbecki

IPC分类号： G06F1/20 ,  G06F1/16 ,  H05K7/20 ,  G06F3/041 ,  H04M1/02

摘要： There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.

公开(公告)号：US20190041922A1

公开(公告)日：2019-02-07

申请号：US16052590

申请日：2018-08-01

申请人： Intel Corporation

发明人： Prakash Kurma Raju ,  Babu Triplicane Gopikrishnan ,  Bijendra Singh ,  Prasanna Pichumani ,  Doddi Raghavendra ,  Harish Jagadish ,  Gopinath Kandasamy ,  David Pidwerbecki

IPC分类号： G06F1/20 ,  G06F1/16 ,  H05K7/20

摘要： There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.

公开(公告)号：US20190326081A1

公开(公告)日：2019-10-24

申请号：US16455576

申请日：2019-06-27

申请人： Intel Corporation

发明人： Prakash Kurma Raju ,  Raghavendra Doddi ,  Prasanna Pichumani ,  Sachin Bedare ,  Bijendra Singh ,  Gopinath Kandasamy

IPC分类号： H01H13/84 ,  H01H13/705 ,  G06F1/16

摘要： Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.

公开(公告)号：US09924270B2

公开(公告)日：2018-03-20

申请号：US14593516

申请日：2015-01-09

申请人： INTEL CORPORATION

发明人： Rajeev Rema Shanmugam ,  Gopinath Kandasamy

IPC分类号： H04R5/033 ,  H04R5/04 ,  H04R1/10

CPC分类号： H04R5/033 ,  H04R1/1041 ,  H04R5/04

摘要： Techniques are provided for automatically channelizing a stereo audio signal in a headphone device such that a correct audio channel is output to a user's ear regardless of which ear an earbud is inserted. In an embodiment, at least one earbud is configured with a sensor arranged on a housing of the earbud. The placement of the sensor can be keyed or otherwise positioned to identify a right or left ear based on proximity/contact with certain anatomy of the ear. For instance, the sensor can be in detectable range of ear anatomy such as a tragus/antitragus when inserted in one ear and outside of detectable range of the same when inserted in the other. By automatically detecting which ear an earbud has been inserted, audio channels can be switched as necessary enabling users to insert earbuds without regard for which is a right earbud and which is a left earbud.