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公开(公告)号：US12114466B2
公开(公告)日：2024-10-08
申请号：US17132477
申请日：2020-12-23
Applicant: Intel Corporation
Inventor： Penchala Pratap Binni Boyina , Kathiravan D , Babu Triplicane Gopikrishnan , Prakash Kurma Raju , Deepak Sekar , Hari Shanker Thakur
IPC: H05K7/20 , F28D15/04 , G06F1/20 , H01L23/40 , H01L23/427
CPC classification number: H05K7/20336 , F28D15/04 , G06F1/203 , H01L23/4006 , H01L23/427 , H01L2023/4087
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.
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公开(公告)号：US11231757B2
公开(公告)日：2022-01-25
申请号：US16052590
申请日：2018-08-01
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Raghavendra Doddi , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
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Patent Agency Ranking
公开(公告)号：US20190041922A1
公开(公告)日：2019-02-07
申请号：US16052590
申请日：2018-08-01
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Doddi Raghavendra , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
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公开(公告)号：US11755080B2
公开(公告)日：2023-09-12
申请号：US17560719
申请日：2021-12-23
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Raghavendra Doddi , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
CPC classification number: G06F1/203 , G06F1/1616 , G06F1/1637 , G06F1/1647 , G06F1/1681 , H04M1/022 , H05K7/2039 , G06F3/041 , G06F2200/203 , H04M1/0216 , H04M2250/16
Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
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公开(公告)号：US20220113759A1
公开(公告)日：2022-04-14
申请号：US17560719
申请日：2021-12-23
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Raghavendra Doddi , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
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公开(公告)号：USD933059S1
公开(公告)日：2021-10-12
申请号：US29664946
申请日：2018-09-28
Applicant: Intel Corporation
Designer： Babu Triplicane Gopikrishnan , Kathiravan D , Prakash Kurma Raju , Prasanna Pichumani
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公开(公告)号：US20210112684A1
公开(公告)日：2021-04-15
申请号：US17132477
申请日：2020-12-23
Applicant: Intel Corporation
Inventor： Penchala Pratap Binni Boyina , Kathiravan D , Babu Triplicane Gopikrishnan , Prakash Kurma Raju , Deepak Sekar , Hari Shanker Thakur
IPC: H05K7/20 , F28D15/04 , H01L23/427 , H01L23/40 , G06F1/20
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.
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