Invention Grant
- Patent Title: Apparatus for and method of monitoring warpage of substrate, substrate treatment apparatus, and substrate-type sensor
-
Application No.: US17083189Application Date: 2020-10-28
-
Publication No.: US11756815B2Publication Date: 2023-09-12
- Inventor: Yong Jun Seo , Sang Hyun Son , Sang Min Ha , Dong Ok Ahn
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Cheonan-si
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Cheonan-si
- Priority: KR 20190137479 2019.10.31
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L23/00 ; H01L21/324 ; G01P15/02 ; G01C19/00 ; H01L23/498
Abstract:
Disclosed is an apparatus for precisely monitoring warpage deformation of a substrate. The apparatus includes a sensing unit and a processor. The sensing unit is removably mounted on the substrate and detects information on the warpage deformation of the substrate during a treatment process performed on the substrate. The processor generates warpage state information on the basis of the warpage information detected by the sensing unit.
Public/Granted literature
Information query
IPC分类:
