公开(公告)号：US20230350438A1

公开(公告)日：2023-11-02

申请号：US17732553

申请日：2022-04-29

申请人： SEMES Co., Ltd.

发明人： Yong Jun Seo ,  Sang Hyun Son ,  Sang Min Ha ,  Hyeong Jun Cho ,  Dong Ok Ahn

IPC分类号： H01L21/67 ,  G05D23/19 ,  G01K3/14

CPC分类号： G05D23/1927 ,  G01K3/14 ,  H01L21/67248 ,  H01L21/67103

摘要： A process measurement apparatus and method capable of increasing production by decreasing an operating time are provided. The process measurement method is performed by a computing device, and includes receiving a plurality of sensed values from a plurality of sensors disposed in a wafer-type temperature sensor, generating a first temperature value of a first heating zone based on the plurality of sensed values, and determining a first compensation value based on a first difference value corresponding to a difference between the first temperature value and a target value, wherein a first compensation ratio between the first difference value and the first compensation value when the first difference value is a first value is different from a second compensation ratio between the first difference value and the first compensation value when the first difference value is a second value.

公开(公告)号：US11756815B2

公开(公告)日：2023-09-12

申请号：US17083189

申请日：2020-10-28

申请人： SEMES CO., LTD.

发明人： Yong Jun Seo ,  Sang Hyun Son ,  Sang Min Ha ,  Dong Ok Ahn

IPC分类号： H01L21/67 ,  H01L23/00 ,  H01L21/324 ,  G01P15/02 ,  G01C19/00 ,  H01L23/498

CPC分类号： H01L21/67248 ,  G01C19/00 ,  G01P15/02 ,  H01L21/324 ,  H01L21/67103 ,  H01L23/4985 ,  H01L23/562

摘要： Disclosed is an apparatus for precisely monitoring warpage deformation of a substrate. The apparatus includes a sensing unit and a processor. The sensing unit is removably mounted on the substrate and detects information on the warpage deformation of the substrate during a treatment process performed on the substrate. The processor generates warpage state information on the basis of the warpage information detected by the sensing unit.

公开(公告)号：US11703520B2

公开(公告)日：2023-07-18

申请号：US17482845

申请日：2021-09-23

申请人： SEMES CO., LTD.

发明人： Yong-Jun Seo ,  Sang Hyun Son ,  Ji Su Hong ,  Jae Myoung Lee ,  Dong Ok Ahn

IPC分类号： G01P5/12 ,  G01P13/04 ,  G01P13/00 ,  G01P13/02

CPC分类号： G01P5/12 ,  G01P13/006 ,  G01P13/02 ,  G01P13/045

摘要： The inventive concept provides a wafer type sensor unit which acquires data on a wind direction and a wind velocity of an air flow during processing, the wafer type sensor unit supported by a supporting unit of a substrate processing apparatus. The unit comprising a wafer-shaped circuit board and a hot-wired wind velocity sensor placed apart from an upper surface of the circuit board.

公开(公告)号：US11577506B2

公开(公告)日：2023-02-14

申请号：US17467266

申请日：2021-09-05

申请人： SEMES CO., LTD.

发明人： Kwang Sup Kim ,  Dong Ok Ahn ,  Jong Min Lee ,  Jun Ho Oh ,  Ji Hoon Yoo ,  Young Ho Park

IPC分类号： B41J2/045 ,  B41J2/175

摘要： Disclosed are an apparatus and a method for quickly and accurately inspecting a droplet on a substrate. An apparatus for inspecting a droplet on a substrate according to an exemplary embodiment of the present disclosure includes: an ultrasonic sensor configured to apply an ultrasonic wave to a droplet on the substrate and detect an ultrasonic wave reflected from the substrate; and a processor configured to acquire a height of the droplet at each position on the substrate on the basis of a signal of the ultrasonic wave reflected from the droplet on the substrate, calculate a volume of the droplet on the basis of the heights of the droplet at the positions, and store or output data in relation to the volume of the droplet. The embodiment of the present disclosure may calculate the volume of the droplet using the ultrasonic wave, thereby quickly and accurately inspecting the droplet on the substrate.