Invention Grant
- Patent Title: Asymmetry correction via variable relative velocity of a wafer
-
Application No.: US17335868Application Date: 2021-06-01
-
Publication No.: US11764069B2Publication Date: 2023-09-19
- Inventor: Jimin Zhang , Brian J. Brown , Eric Lau , Ekaterina Mikhaylichenko , Jeonghoon Oh , Gerald J. Alonzo
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: PATTERSON & SHERIDAN, LLP
- Main IPC: H01L21/321
- IPC: H01L21/321 ; B24B37/10 ; H01L21/306 ; B24B37/04
Abstract:
Certain aspects of the present disclosure provide techniques for a method of removing material on a substrate. An exemplary method includes rotating a substrate about a first axis in a first direction and urging a surface of the substrate against a polishing surface of a polishing pad while rotating the substrate, wherein rotating the substrate about the first axis includes rotating the substrate a first angle at a first rotation rate, and then rotating the substrate a second angle at a second rotation rate, and the first rotation rate is different from the second rotation rate.
Public/Granted literature
- US20220379428A1 ASYMMETRY CORRECTION VIA VARIABLE RELATIVE VELOCITY OF A WAFER Public/Granted day:2022-12-01
Information query
IPC分类:
