Invention Grant
- Patent Title: Right angle sidewall and button interconnects for molded SiPs
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Application No.: US17407670Application Date: 2021-08-20
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Publication No.: US11765838B2Publication Date: 2023-09-19
- Inventor: Bilal Mohamed Ibrahim Kani , Ali N. Ergun , Kishore N. Renjan , Kyusang Kim , Manoj Vadeentavida , Benjamin J. Grena , David M. Kindlon , Lan H. Hoang
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Aikin & Gallant, LLP
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/14 ; H05K3/18 ; H05K3/36 ; H05K3/00 ; H05K3/34 ; H05K3/40
Abstract:
Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
Public/Granted literature
- US20230055647A1 Right Angle Sidewall and Button Interconnects for Molded SiPs Public/Granted day:2023-02-23
Information query
