Invention Grant
- Patent Title: Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
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Application No.: US16298802Application Date: 2019-03-11
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Publication No.: US11772229B2Publication Date: 2023-10-03
- Inventor: Sivapackia Ganapathiappan , Boyi Fu , Ashwin Chockalingam , Daniel Redfield , Rajeev Bajaj , Mahendra C. Orilall , Hou T. Ng , Jason G. Fung , Mayu Yamamura
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- The original application number of the division: US15287665 2016.10.06
- Main IPC: B24B37/24
- IPC: B24B37/24

Abstract:
Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.
Public/Granted literature
- US20190202024A1 METHOD AND APPARATUS FOR FORMING POROUS ADVANCED POLISHING PADS USING AN ADDITIVE MANUFACTURING PROCESS Public/Granted day:2019-07-04
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