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公开(公告)号：US11072050B2
公开(公告)日：2021-07-27
申请号：US16050442
申请日：2018-07-31
Applicant: Applied Materials, Inc.
Inventor： Boyi Fu , Sivapackia Ganapathiappan , Daniel Redfield , Rajeev Bajaj , Ashwin Chockalingam , Dominic J. Benvegnu , Mario Dagio Cornejo , Mayu Yamamura , Nag B. Patibandla , Ankit Vora
Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.
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公开(公告)号：US11471999B2
公开(公告)日：2022-10-18
申请号：US16042016
申请日：2018-07-23
Applicant: Applied Materials, Inc.
Inventor： Ashavani Kumar , Ashwin Chockalingam , Sivapackia Ganapathiappan , Rajeev Bajaj , Boyi Fu , Daniel Redfield , Nag B. Patibandla , Mario Dagio Cornejo , Amritanshu Sinha , Yan Zhao , Ranga Rao Arnepalli , Fred C. Redeker
IPC: B24B37/24 , B24D11/04 , B24B37/26 , B24D18/00 , B24B37/16 , B24B37/20 , B33Y80/00 , B33Y10/00 , B29C64/112 , B33Y30/00 , H01L21/306
Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
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公开(公告)号：US10773509B2
公开(公告)日：2020-09-15
申请号：US15452053
申请日：2017-03-07
Applicant: Applied Materials, Inc.
Inventor： Hou T. Ng , Nag B. Patibandla , Rajeev Bajaj , Daniel Redfield , Ashwin Chockalingam , Mayu Yamamura , Mario Cornejo
Abstract: A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.
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公开(公告)号：US11851570B2
公开(公告)日：2023-12-26
申请号：US16668961
申请日：2019-10-30
Applicant: Applied Materials, Inc.
Inventor： Uma Sridhar , Sivapackia Ganapathiappan , Ashwin Chockalingam , Yingdong Luo , Daniel Redfield , Rajeev Bajaj , Nag B. Patibandla , Hou T. Ng , Sudhakar Madhusoodhanan
IPC: B29C64/112 , C09D11/38 , B24B37/24 , C09D11/107 , C09D11/101 , B33Y80/00 , B33Y70/00 , B29L31/00 , B29K33/00 , B33Y10/00
CPC classification number: C09D11/38 , B24B37/245 , B33Y70/00 , B33Y80/00 , C09D11/101 , C09D11/107 , B29C64/112 , B29K2033/08 , B29L2031/736 , B33Y10/00
Abstract: Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.
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公开(公告)号：US10456886B2
公开(公告)日：2019-10-29
申请号：US15394044
申请日：2016-12-29
Applicant: Applied Materials, Inc.
Inventor： Sivapackia Ganapathiappan , Nag B. Patibandla , Rajeev Bajaj , Daniel Redfield , Fred C. Redeker , Mahendra C. Orilall , Boyi Fu , Mayu Yamamura , Ashwin Chockalingam
Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
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Patent Agency Ranking
公开(公告)号：US10391605B2
公开(公告)日：2019-08-27
申请号：US15287665
申请日：2016-10-06
Applicant: Applied Materials, Inc.
Inventor： Sivapackia Ganapathiappan , Boyi Fu , Ashwin Chockalingam , Daniel Redfield , Rajeev Bajaj , Mahendra C. Orilall , Hou T. Ng , Jason G. Fung , Mayu Yamamura
IPC: B24B37/24
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.
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公开(公告)号：US10384330B2
公开(公告)日：2019-08-20
申请号：US14885950
申请日：2015-10-16
Applicant: Applied Materials, Inc.
Inventor： Rajeev Bajaj , Daniel Redfield , Mahendra C. Orilall , Boyi Fu , Aniruddh Khanna , Jason G. Fung , Mario Cornejo , Ashwin Chockalingam , Mayu Yamamura , Veera Raghava Reddy Kakireddy , Ashavani Kumar , Venkat Hariharan , Gregory E. Menk , Fred C. Redeker , Nag B. Patibandla , Hou T. Ng , Robert E. Davenport , Amritanshu Sinha
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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公开(公告)号：US11980992B2
公开(公告)日：2024-05-14
申请号：US17946547
申请日：2022-09-16
Applicant: Applied Materials, Inc.
Inventor： Ashavani Kumar , Ashwin Chockalingam , Sivapackia Ganapathiappan , Rajeev Bajaj , Boyi Fu , Daniel Redfield , Nag B. Patibandla , Mario Dagio Cornejo , Amritanshu Sinha , Yan Zhao , Ranga Rao Arnepalli , Fred C. Redeker
IPC: B24B37/24 , B24B37/16 , B24B37/20 , B24B37/26 , B24D11/04 , B24D18/00 , B29C64/112 , B33Y10/00 , B33Y30/00 , B33Y80/00 , H01L21/306
CPC classification number: B24B37/245 , B24B37/26 , B24D11/04 , B24D18/00 , B29C64/112 , B33Y10/00 , B33Y80/00 , B24B37/16 , B24B37/20 , B24D2203/00 , B33Y30/00 , H01L21/30625
Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
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公开(公告)号：US11826876B2
公开(公告)日：2023-11-28
申请号：US16375506
申请日：2019-04-04
Applicant: Applied Materials, Inc.
Inventor： Sivapackia Ganapathiappan , Boyi Fu , Ashwin Chockalingam , Ankit Vora , Daniel Redfield , Rajeev Bajaj , Nag B. Patibandla , Hou T. Ng , Sudhakar Madhusoodhanan
IPC: B24B37/22 , B24B37/24 , B33Y70/00 , B29C64/112 , B33Y10/00 , B24B37/26 , B24B7/22 , B22F10/14 , B33Y80/00 , B22F10/12 , B22F10/18 , B22F10/25 , B22F10/28 , B22F10/68 , B22F12/55 , B22F12/58
CPC classification number: B24B7/22 , B22F10/14 , B24B37/24 , B24B37/26 , B29C64/112 , B33Y70/00 , B22F10/12 , B22F10/18 , B22F10/25 , B22F10/28 , B22F10/68 , B22F12/55 , B22F12/58 , B33Y10/00 , B33Y80/00 , B22F2999/00 , B22F1/10 , B22F10/10
Abstract: In one implementation, a method of forming a porous polishing pad is provided. The method comprises depositing a plurality of composite layers with a 3D printer to reach a target thickness. Depositing the plurality of composite layers comprises dispensing one or more droplets of a curable resin precursor composition onto a support. Depositing the plurality of composite layers further comprises dispensing one or more droplets of a porosity-forming composition onto the support, wherein at least one component of the porosity-forming composition is removable to form the pores in the porous polishing pad.
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公开(公告)号：US11745302B2
公开(公告)日：2023-09-05
申请号：US17209137
申请日：2021-03-22
Applicant: Applied Materials, Inc.
Inventor： Sivapackia Ganapathiappan , Boyi Fu , Ashwin Chockalingam , Daniel Redfield , Rajeev Bajaj , Mahendra C. Orilall , Hou T. Ng , Jason G. Fung , Mayu Yamamura
IPC: B24B37/24 , B33Y70/00 , B24D3/28 , B33Y10/00 , B33Y80/00 , C09G1/16 , B33Y70/10 , B29K33/04 , B24B37/22 , B24B37/26 , B29C64/112 , B24D11/00 , B24D11/04 , B29C35/08 , C09D4/00
CPC classification number: B24B37/24 , B24B37/22 , B24B37/26 , B24D3/28 , B24D11/001 , B24D11/04 , B29C35/0805 , B29C64/112 , B33Y10/00 , B33Y70/00 , B33Y80/00 , C09D4/00 , C09G1/16 , B24D2203/00 , B29C2035/0827 , B29K2033/04 , B29K2995/0077 , B29K2995/0092 , B33Y70/10
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.
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