Invention Grant
- Patent Title: Shielded semiconductor package with open terminal and methods of making
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Application No.: US17136197Application Date: 2020-12-29
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Publication No.: US11784133B2Publication Date: 2023-10-10
- Inventor: ChangOh Kim , KyoWang Koo , SungWon Cho , BongWoo Choi , JiWon Lee
- Applicant: STATS ChipPAC Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: PATENT LAW GROUP: Atkins and Associates, P.C.
- Agent Brian M. Kaufman; Robert D. Atkins
- The original application number of the division: US16220934 2018.12.14
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/552 ; H01L21/311 ; H01L21/56 ; H01L23/31 ; H01L23/00 ; H01L23/66
Abstract:
A semiconductor device has a substrate. An electrical component is disposed over a surface of the substrate. An encapsulant is deposited over the electrical component and substrate. A portion of the surface of the substrate remains exposed from the encapsulant. A shielding layer is formed over the encapsulant. A portion of the shielding layer is removed to expose the portion of the surface of the substrate.
Public/Granted literature
- US20210118810A1 Shielded Semiconductor Package with Open Terminal and Methods of Making Public/Granted day:2021-04-22
Information query
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