Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17895066Application Date: 2022-08-25
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Publication No.: US11804526B2Publication Date: 2023-10-31
- Inventor: Yi-Chieh Wang , Po-Chun Lai , Ke-Feng Lin , Chen-An Kuo , Ze-Wei Jhou
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN 2110175890.X 2021.02.09
- The original application number of the division: US17200908 2021.03.15
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L31/062 ; H01L29/94 ; H01L29/40 ; H01L27/088 ; H01L29/78

Abstract:
A semiconductor device includes a semiconductor substrate, a gate structure, a source region, a drain region, and a plurality of field plates. The gate structure is disposed on the semiconductor substrate. The source region and the drain region are disposed in the semiconductor substrate and located at two opposite sides of the gate structure in a first direction respectively. The field plates are disposed on the semiconductor substrate. Each of the field plates is partly located above the gate structure and partly located between the gate structure and the drain region. The gate structure is electrically connected with at least one of the field plates, and the source region is electrically connected with at least one of the field plates.
Public/Granted literature
- US20220406904A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-12-22
Information query
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