- 专利标题： Composition, method for cleaning adhesive polymer, method for producing device wafer, and method for regenerating support wafer
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申请号： US17269692申请日： 2019-09-26
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公开(公告)号： US11807837B2公开(公告)日： 2023-11-07
- 发明人: Susumu Nakazaki , Kuniaki Miyahara , Tomoyuki Fukuyo
- 申请人： SHOWA DENKO K.K.
- 申请人地址： JP Tokyo
- 专利权人： Resonac Corporation
- 当前专利权人： Resonac Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP 18195431 2018.10.16
- 国际申请： PCT/JP2019/037993 2019.09.26
- 国际公布： WO2020/080060A 2020.04.23
- 进入国家日期： 2021-02-19
- 主分类号： C11D7/50
- IPC分类号： C11D7/50 ; C11D7/32 ; C11D11/00 ; H01L21/02
摘要：
Provided is a composition having high affinity for the surface of an adhesive, and excellent long-term storage stability. This composition comprises: a quaternary alkylammonium fluoride or a hydrate of a quaternary alkylammonium fluoride; and an aprotic solvent, wherein the aprotic solvent includes (A) an N-substituted amide compound having 4 or more carbon atoms and not containing active hydrogen on a nitrogen atom, and (B) an ether compound.
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