专利检索 ap:("SHOWA DENKO K.K.") AND inv:"Kuniaki Miyahara" 第 1 页

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发明授权
Composition, method for cleaning adhesive polymer, method for producing device wafer, and method for regenerating support wafer 有权

公开(公告)号：US11807837B2

公开(公告)日：2023-11-07

申请号：US17269692

申请日：2019-09-26

申请人： SHOWA DENKO K.K.

发明人： Susumu Nakazaki , Kuniaki Miyahara , Tomoyuki Fukuyo

IPC分类号： C11D7/50 , C11D7/32 , C11D11/00 , H01L21/02

CPC分类号： C11D7/3209 , C11D7/5013 , C11D7/5022 , C11D11/0047 , H01L21/02057

摘要： Provided is a composition having high affinity for the surface of an adhesive, and excellent long-term storage stability. This composition comprises: a quaternary alkylammonium fluoride or a hydrate of a quaternary alkylammonium fluoride; and an aprotic solvent, wherein the aprotic solvent includes (A) an N-substituted amide compound having 4 or more carbon atoms and not containing active hydrogen on a nitrogen atom, and (B) an ether compound.