Invention Grant
- Patent Title: Modular I/O configurations for edge computing using disaggregated chiplets
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Application No.: US17737413Application Date: 2022-05-05
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Publication No.: US11831507B2Publication Date: 2023-11-28
- Inventor: Francesc Guim Bernat , Kshitij Arun Doshi , Ned M. Smith , Timothy Verrall , Uzair Qureshi
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H04L41/084
- IPC: H04L41/084 ; H04L41/0869 ; H04L49/00 ; H04L47/78 ; H04L41/5054 ; G06F9/48 ; G06F9/50 ; G06F9/54 ; G06F11/30 ; H04L9/06 ; H04L9/32 ; G06F1/20 ; H04L67/10 ; H04W4/08 ; H04W12/04

Abstract:
Various approaches for deployment and use of configurable edge computing platforms are described. In an edge computing system, an edge computing device includes hardware resources that can be composed from a configuration of chiplets, as the chiplets are disaggregated for selective use and deployment (for compute, acceleration, memory, storage, or other resources). In an example, configuration operations are performed to: identify a condition for use of the hardware resource, based on an edge computing workload received at the edge computing device; obtain, determine, or identify properties of a configuration for the hardware resource that are available to be implemented with the chiplets, with the configuration enabling the hardware resource to satisfy the condition for use of the hardware resource; and compose the chiplets into the configuration, according to the properties of the configuration, to enable the use of the hardware resource for the edge computing workload.
Public/Granted literature
- US20220337481A1 MODULAR I/O CONFIGURATIONS FOR EDGE COMPUTING USING DISAGGREGATED CHIPLETS Public/Granted day:2022-10-20
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