- 专利标题： Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board
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申请号： US16736997申请日： 2020-01-08
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公开(公告)号： US11840619B2公开(公告)日： 2023-12-12
- 发明人: Yoshitaka Takezawa , Shingo Tanaka , Fusao Hojo
- 申请人： HITACHI CHEMICAL COMPANY, LTD.
- 申请人地址： JP Tokyo
- 专利权人： RESONAC CORPORATION
- 当前专利权人： RESONAC CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： FITCH, EVEN, TABIN & FLANNERY, LLP
- 优先权： JP 15104427 2015.05.22
- 主分类号： C08K3/38
- IPC分类号： C08K3/38 ; B32B15/092 ; B32B27/18 ; B32B27/26 ; B32B27/38 ; H05K1/03 ; C08L63/00 ; C08G59/24 ; C08G59/20 ; C08J5/24 ; B32B5/02 ; B32B15/14 ; H05K1/02
摘要：
Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.
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