公开(公告)号：US11840619B2

公开(公告)日：2023-12-12

申请号：US16736997

申请日：2020-01-08

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Yoshitaka Takezawa ,  Shingo Tanaka ,  Fusao Hojo

IPC分类号： C08K3/38 ,  B32B15/092 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38 ,  H05K1/03 ,  C08L63/00 ,  C08G59/24 ,  C08G59/20 ,  C08J5/24 ,  B32B5/02 ,  B32B15/14 ,  H05K1/02

CPC分类号： C08K3/38 ,  B32B5/024 ,  B32B15/092 ,  B32B15/14 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38 ,  C08G59/20 ,  C08G59/24 ,  C08G59/245 ,  C08J5/249 ,  C08L63/00 ,  H05K1/0201 ,  H05K1/03 ,  H05K1/0373 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/302 ,  B32B2457/08 ,  C08J2363/04 ,  C08K2003/385 ,  C08K3/38 ,  C08L63/00

摘要： Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.

公开(公告)号：US10597485B2

公开(公告)日：2020-03-24

申请号：US16477353

申请日：2017-10-17

申请人： Hitachi Chemical Company, Ltd.

发明人： Shingo Tanaka ,  Tomoko Higashiuchi ,  Naoki Maruyama ,  Kazumasa Fukuda ,  Yoshitaka Takezawa ,  Fusao Hojo

IPC分类号： C08G59/02 ,  C08G59/24 ,  C08G59/50

摘要： A production method for a glassy liquid-crystalline epoxy resin, comprising a process of cooling a liquid-crystalline epoxy resin to cause transition into a glassy state.

公开(公告)号：US10584228B2

公开(公告)日：2020-03-10

申请号：US15575440

申请日：2016-05-20

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Yoshitaka Takezawa ,  Shingo Tanaka ,  Fusao Hojo

IPC分类号： C08K3/38 ,  B32B15/092 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38 ,  C08J5/24 ,  H05K1/03 ,  C08L63/00 ,  C08G59/24 ,  C08G59/20 ,  B32B5/02 ,  B32B15/14 ,  H05K1/02

摘要： Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.