Invention Grant
- Patent Title: Test kit for testing a device under test
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Application No.: US17735130Application Date: 2022-05-03
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Publication No.: US11879934B2Publication Date: 2024-01-23
- Inventor: Jing-Hui Zhuang , Ying-Chou Shih , Sheng-Wei Lei , Chang-Lin Wei , Chih-Yang Liu , Che-Hsien Huang , Yi-Chieh Lin
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R31/66 ; G01R31/26
Abstract:
A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.
Public/Granted literature
- US20220397600A1 TEST KIT FOR TESTING A DEVICE UNDER TEST Public/Granted day:2022-12-15
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