公开(公告)号：US11879934B2

公开(公告)日：2024-01-23

申请号：US17735130

申请日：2022-05-03

Applicant: MEDIATEK INC.

Inventor： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Sheng-Wei Lei ,  Chang-Lin Wei ,  Chih-Yang Liu ,  Che-Hsien Huang ,  Yi-Chieh Lin

IPC: G01R31/28 ,  G01R31/66 ,  G01R31/26

CPC classification number: G01R31/2886 ,  G01R31/26 ,  G01R31/66 ,  G01R31/2893

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.

公开(公告)号：US20250130256A1

公开(公告)日：2025-04-24

申请号：US18906148

申请日：2024-10-03

Applicant: MEDIATEK INC.

Inventor： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Chang-Lin Wei ,  Sheng-Wei Lei ,  Chih-Yang Liu ,  Jhih-Huei Chiu ,  Yen-Hui Li ,  Che-Sheng Lin

IPC: G01R1/073 ,  G01R31/28

Abstract: A probe head includes an upper pin holder and a lower pin holder coupled to the upper pin holder. A pin arrangement space is defined between the upper pin holder and the lower pin holder. A conductive film is disposed between the upper pin holder and the lower pin holder. A plurality of probe pins penetrates through the upper pin holder, the conductor film and the lower pin holder, and extends outwardly from a bottom surface of the lower pin holder.

公开(公告)号：US20220397600A1

公开(公告)日：2022-12-15

申请号：US17735130

申请日：2022-05-03

Applicant: MEDIATEK INC.

Inventor： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Sheng-Wei Lei ,  Chang-Lin Wei ,  Chih-Yang Liu ,  Che-Hsien Huang ,  Yi-Chieh Lin

IPC: G01R31/28 ,  G01R31/66 ,  G01R31/26

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.

公开(公告)号：US20190310314A1

公开(公告)日：2019-10-10

申请号：US16359954

申请日：2019-03-20

Applicant: MEDIATEK INC.

Inventor： Chih-Yang Liu ,  Ying-Chou Shih ,  Yen-Ju Lu ,  Chih-Ming Hung ,  Jui-Lin Hsu

IPC: G01R31/302 ,  H01Q1/22 ,  G01R31/303 ,  G01R31/28

Abstract: A wireless test system includes a load board having an upper surface and a lower surface. The load board has a testing antenna disposed on the load board. A socket for receiving a device under test (DUT) having an antenna structure therein is disposed on the upper surface of the load board. The antenna structure is aligned with the testing antenna. The wireless test system further includes a handler for picking up and delivering the DUT to the socket. The handler has a clamp for holding and pressing the DUT. The clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna.

公开(公告)号：US10852349B2

公开(公告)日：2020-12-01

申请号：US16359954

申请日：2019-03-20

Applicant: MEDIATEK INC.

Inventor： Chih-Yang Liu ,  Ying-Chou Shih ,  Yen-Ju Lu ,  Chih-Ming Hung ,  Jui-Lin Hsu

IPC: G01R31/30 ,  G01R31/302 ,  G01R31/28 ,  G01R31/303 ,  H01Q1/22 ,  G01R1/04

Abstract: A wireless test system includes a load board having an upper surface and a lower surface. The load board has a testing antenna disposed on the load board. A socket for receiving a device under test (DUT) having an antenna structure therein is disposed on the upper surface of the load board. The antenna structure is aligned with the testing antenna. The wireless test system further includes a handler for picking up and delivering the DUT to the socket. The handler has a clamp for holding and pressing the DUT. The clamp is grounded during testing and functions as a ground reflector that reflects and reverses radiation pattern of the DUT from an upward direction to a downward direction toward the testing antenna.