公开(公告)号：US20230236222A1

公开(公告)日：2023-07-27

申请号：US18129040

申请日：2023-03-30

Applicant: MEDIATEK INC.

Inventor： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Sheng-Wei Lei ,  Chang-Lin Wei ,  Che-Hsien Huang ,  Shih-Chia Chiu ,  Yi-Chieh Lin ,  Wun-Jian Lin

IPC: G01R1/04

CPC classification number: G01R1/0466

Abstract: This disclosure provides a test kit for testing a device under test (DUT) including a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having a nest and an interposer substrate installed under the nest.

公开(公告)号：US11879934B2

公开(公告)日：2024-01-23

申请号：US17735130

申请日：2022-05-03

Applicant: MEDIATEK INC.

Inventor： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Sheng-Wei Lei ,  Chang-Lin Wei ,  Chih-Yang Liu ,  Che-Hsien Huang ,  Yi-Chieh Lin

IPC: G01R31/28 ,  G01R31/66 ,  G01R31/26

CPC classification number: G01R31/2886 ,  G01R31/26 ,  G01R31/66 ,  G01R31/2893

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.

公开(公告)号：US20250130256A1

公开(公告)日：2025-04-24

申请号：US18906148

申请日：2024-10-03

Applicant: MEDIATEK INC.

Inventor： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Chang-Lin Wei ,  Sheng-Wei Lei ,  Chih-Yang Liu ,  Jhih-Huei Chiu ,  Yen-Hui Li ,  Che-Sheng Lin

IPC: G01R1/073 ,  G01R31/28

Abstract: A probe head includes an upper pin holder and a lower pin holder coupled to the upper pin holder. A pin arrangement space is defined between the upper pin holder and the lower pin holder. A conductive film is disposed between the upper pin holder and the lower pin holder. A plurality of probe pins penetrates through the upper pin holder, the conductor film and the lower pin holder, and extends outwardly from a bottom surface of the lower pin holder.

公开(公告)号：US20220397600A1

公开(公告)日：2022-12-15

申请号：US17735130

申请日：2022-05-03

Applicant: MEDIATEK INC.

Inventor： Jing-Hui Zhuang ,  Ying-Chou Shih ,  Sheng-Wei Lei ,  Chang-Lin Wei ,  Chih-Yang Liu ,  Che-Hsien Huang ,  Yi-Chieh Lin

IPC: G01R31/28 ,  G01R31/66 ,  G01R31/26

Abstract: A test kit for testing a device under test (DUT) includes a socket structure for containing the DUT, and a plunger assembly detachably coupled with the socket structure. The plunger assembly includes a multi-layered structure having at least an interposer substrate sandwiched by a top socket and a nest.