Invention Grant
- Patent Title: Magnetoresistive random access memory structure and method of manufacturing the same
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Application No.: US17239667Application Date: 2021-04-25
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Publication No.: US11882769B2Publication Date: 2024-01-23
- Inventor: Hui-Lin Wang , Bo-Yun Huang , Wen-Wen Zhang , Kun-Chen Ho
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN 2110291982.4 2021.03.18
- Main IPC: H01L43/02
- IPC: H01L43/02 ; H10N50/80 ; H10B61/00 ; H10N50/01

Abstract:
A magnetoresistive random access memory (MRAM) structure is provided in the present invention, including multiple MRAM cells, and an atomic layer deposition dielectric layer between and at outer sides of the MRAM cells, wherein the material of top electrode layer is titanium nitride, and the nitrogen percentage is greater than titanium percentage and further greater than oxygen percentage in the titanium nitride, and the nitrogen percentage gradually increases inward from the top surface of top electrode layer to a depth and then start to gradually decrease to a first level and then remains constant, and the titanium percentage gradually decreases inward from the top surface of top electrode layer to the depth and then start to gradually increase to a second level and then remains constant.
Public/Granted literature
- US20220302369A1 MAGNETORESISTIVE RANDOM ACCESS MEMORY STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2022-09-22
Information query
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