Invention Grant
- Patent Title: Apparatus and method for processing substrate
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Application No.: US17520826Application Date: 2021-11-08
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Publication No.: US11908710B2Publication Date: 2024-02-20
- Inventor: Jin Woo Jung , Do Hyeon Yoon , Yong Hee Lee
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Cheonan-si
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Cheonan-si
- Priority: KR 20200185936 2020.12.29
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02 ; H01L21/677

Abstract:
A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.
Public/Granted literature
- US20220208565A1 APPARATUS AND METHOD FOR PROCESSING SUBSTRATE Public/Granted day:2022-06-30
Information query
IPC分类: