公开(公告)号：US12272543B2

公开(公告)日：2025-04-08

申请号：US18068917

申请日：2022-12-20

Applicant: SEMES CO., LTD.

Inventor： Yong Hyun Choi ,  Young Hun Lee ,  Seung Hoon Oh ,  Mi So Park ,  Tae Jong Choi ,  Yong Sun Ko ,  Jin Woo Jung

IPC: H01L21/02 ,  B08B3/02 ,  F26B5/00

Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.

公开(公告)号：US12094705B2

公开(公告)日：2024-09-17

申请号：US17892214

申请日：2022-08-22

Applicant: SEMES CO., LTD.

Inventor： Jin Woo Jung ,  Myung Seok Cha

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02101 ,  H01L21/67034 ,  H01L21/67057

Abstract: Provided is a substrate treating apparatus including: a fluid supply unit supplying a supercritical fluid to the treatment space, a plurality of components installed in the fluid supply line; and a detection member detecting whether or not metal particles are released from the component. The detection member includes: an upstream detection port connected to the fluid supply line upstream from a first component which is one of the plurality of components; a downstream detection port connected to the fluid supply line downstream from the first component; and a detector provided to be coupled to a selected detection port between the upstream detection port and the downstream detection port, and detecting metal particles from a fluid flowing through the detection port from the fluid supply line.

公开(公告)号：US11908710B2

公开(公告)日：2024-02-20

申请号：US17520826

申请日：2021-11-08

Applicant: SEMES CO., LTD.

Inventor： Jin Woo Jung ,  Do Hyeon Yoon ,  Yong Hee Lee

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677

CPC classification number: H01L21/67028 ,  H01L21/02101 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/67739

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

公开(公告)号：US20230201883A1

公开(公告)日：2023-06-29

申请号：US18068869

申请日：2022-12-20

Applicant: SEMES CO., LTD.

Inventor： Yong Hyun Choi ,  Young Hun Lee ,  Yong Joon Im ,  Seung Hoon Oh ,  Tae Jong Choi ,  Yong Sun Ko ,  Sang Min Lee ,  Jin Woo Jung

IPC: B08B3/02 ,  H01L21/67 ,  H01L21/687 ,  B08B13/00 ,  B25J11/00 ,  F26B3/28

CPC classification number: B08B3/022 ,  H01L21/67173 ,  H01L21/68707 ,  B08B13/00 ,  B25J11/0095 ,  F26B3/283

Abstract: Disclosed is an apparatus for treating a substrate. The apparatus for treating the substrate includes a liquid treating chamber for liquid-treating the substrate by supplying a treatment liquid to the substrate, a drying chamber for drying the substrate by supplying a process fluid to the substrate, a transfer unit for transferring the substrate between the liquid treating chamber and the drying chamber, and a rear surface cleaning unit for cleaning a rear surface of the substrate, in which the rear surface cleaning unit may clean the rear surface of the substrate while transferring the substrate from the liquid treating chamber to the drying chamber.

公开(公告)号：US12278119B2

公开(公告)日：2025-04-15

申请号：US17837135

申请日：2022-06-10

Applicant: SEMES CO., LTD.

Inventor： Myung Seok Cha ,  Sang Min Lee ,  Jin Woo Jung ,  Do Hyeon Yoon

IPC: H01L21/67 ,  C23C16/44 ,  H01L21/02

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing an inner space; a fluid supply unit configured to supply a treating fluid to the inner space; and a fluid exhaust unit configured to exhaust the treating fluid from the inner space, and wherein the fluid exhaust unit includes: an exhaust line connected to the chamber; and a pressure adjusting member installed at the exhaust line and configured to maintain a pressure of the inner space to a set pressure, and wherein the fluid supply unit includes: a fluid supply source; and a supply line provided between the fluid supply source and the chamber, and wherein at the supply line or the exhaust line a flow rate measuring member configured to measure a flow rate per unit time of the treating fluid flowing at the inner space is installed.