Invention Grant
- Patent Title: Parallel-connected trench capacitor structure with multiple electrode layers and method of fabricating the same
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Application No.: US16854887Application Date: 2020-04-21
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Publication No.: US11929213B2Publication Date: 2024-03-12
- Inventor: Purakh Raj Verma , Ching-Yang Wen , Xingxing Chen , Chao Jin
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN 2010248852.8 2020.04.01
- Main IPC: H01G4/38
- IPC: H01G4/38 ; H01G4/008 ; H01L21/288 ; H01L21/321 ; H01L23/522 ; H01L23/528 ; H01L27/01 ; H01L49/02

Abstract:
A structure of capacitors connected in parallel includes a substrate. A trench embedded in the substrate. Numerous electrode layers respectively conformally fill in and cover the trench. The electrode layers are formed of numerous nth electrode layers, wherein n is a positive integer from 1 to M, and M is not less than 3. The nth electrode layer with smaller n is closer to the sidewall of the trench. When n equals to M, the Mth electrode layer fills in the center of the trench, and the top surface of the Mth electrode is aligned with the top surface of the substrate. A capacitor dielectric layer is disposed between the adjacent electrode layers. A first conductive plug contacts the nth electrode layer with odd-numbered n. A second conductive plug contacts the nth electrode layer with even-numbered n.
Public/Granted literature
- US20210313116A1 PARALLEL-CONNECTED CAPACITOR STRUCTURE AND METHOD OF FABRICATING THE SAME Public/Granted day:2021-10-07
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