Invention Grant
- Patent Title: Method of fabricating reticle
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Application No.: US17315087Application Date: 2021-05-07
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Publication No.: US11940737B2Publication Date: 2024-03-26
- Inventor: Hsueh-Yi Chung , Yung-Cheng Chen , Fei-Gwo Tsai , Chi-Hung Liao , Shih-Chi Fu , Wei-Ti Hsu , Jui-Ping Chuang , Tzong-Sheng Chang , Kuei-Shun Chen , Meng-Wei Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- The original application number of the division: US16127017 2018.09.10
- Main IPC: G03F7/20
- IPC: G03F7/20 ; G03F1/50 ; G03F1/68 ; G03F1/70 ; G03F1/78 ; G03F7/00 ; H01L21/66
Abstract:
A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.
Public/Granted literature
- US20210263425A1 METHOD OF FABRICATING RETICLE Public/Granted day:2021-08-26
Information query
IPC分类:
