-
公开(公告)号：US11003091B2
公开(公告)日：2021-05-11
申请号：US16740256
申请日：2020-01-10
发明人： Hsueh-Yi Chung , Yung-Cheng Chen , Fei-Gwo Tsai , Chi-Hung Liao , Shih-Chi Fu , Wei-Ti Hsu , Jui-Ping Chuang , Tzong-Sheng Chang , Kuei-Shun Chen , Meng-Wei Chen
摘要： A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.
-
2.发明授权公开(公告)号：US10073354B2
公开(公告)日：2018-09-11
申请号：US14706871
申请日：2015-05-07
发明人： Hsueh-Yi Chung , Yung-Cheng Chen , Fei-Gwo Tsai , Chi-Hung Liao , Shih-Chi Fu , Wei-Ti Hsu , Jui-Ping Chuang , Tzong-Sheng Chang , Kuei-Shun Chen , Meng-Wei Chen
CPC分类号： G03F7/70433 , G03F1/50 , G03F1/68 , G03F1/70 , G03F1/78 , G03F7/20 , G03F7/70141 , G03F7/70158 , G03F7/70716 , H01L22/30
摘要： A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.
-
公开(公告)号：US11940737B2
公开(公告)日：2024-03-26
申请号：US17315087
申请日：2021-05-07
发明人： Hsueh-Yi Chung , Yung-Cheng Chen , Fei-Gwo Tsai , Chi-Hung Liao , Shih-Chi Fu , Wei-Ti Hsu , Jui-Ping Chuang , Tzong-Sheng Chang , Kuei-Shun Chen , Meng-Wei Chen
CPC分类号： G03F7/70433 , G03F1/50 , G03F1/68 , G03F1/70 , G03F1/78 , G03F7/20 , G03F7/70141 , G03F7/70158 , G03F7/70716 , H01L22/30
摘要： A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.
-
公开(公告)号：US10534272B2
公开(公告)日：2020-01-14
申请号：US16127017
申请日：2018-09-10
发明人： Hsueh-Yi Chung , Yung-Cheng Chen , Fei-Gwo Tsai , Chi-Hung Liao , Shih-Chi Fu , Wei-Ti Hsu , Jui-Ping Chuang , Tzong-Sheng Chang , Kuei-Shun Chen , Meng-Wei Chen
摘要： A method for exposing a wafer substrate includes forming a reticle having a device pattern. A relative orientation between the device pattern and a mask field of an exposure tool is determined based on mask field utilization. The reticle is loaded on the exposure tool. The wafer substrate is rotated based on an orientation of the device pattern. Radiation is projected through the reticle onto the rotated wafer substrate by the exposure tool, thereby imaging the device pattern onto the rotated wafer substrate.
-
-
-
搜索结果
4 条记录 (耗时 0.012 秒)
