Invention Grant
- Patent Title: Adhesive composition for semiconductor circuit connection and adhesive film containing the same
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Application No.: US17266023Application Date: 2020-06-05
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Publication No.: US11993731B2Publication Date: 2024-05-28
- Inventor: Junghak Kim , You Jin Kyung , Kwang Joo Lee , Minsu Jeong , Ju Hyeon Kim , Youngsam Kim
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: ROTHWELL, FIGG, ERNST & MANBECK, P.C
- Priority: KR 20190068110 2019.06.10 KR 20200067603 2020.06.04
- International Application: PCT/KR2020/007338 2020.06.05
- International Announcement: WO2020/251219A 2020.12.17
- Date entered country: 2021-02-04
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C08G59/30 ; C08G59/32 ; C08G77/14 ; C08L33/20 ; C08L63/00 ; C08L83/06 ; C09J7/00 ; C09J7/10 ; C09J7/30 ; C09J11/00 ; C09J11/04 ; C09J11/06 ; C09J133/20 ; C09J183/06 ; C09J183/12
Abstract:
The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.
Public/Granted literature
- US20210292616A1 ADHESIVE COMPOSITION FOR SEMICONDUCTOR CIRCUIT CONNECTION AND ADHESIVE FILM CONTAINING THE SAME Public/Granted day:2021-09-23
Information query
