公开(公告)号：US11993731B2

公开(公告)日：2024-05-28

申请号：US17266023

申请日：2020-06-05

Applicant: LG CHEM, LTD.

Inventor： Junghak Kim ,  You Jin Kyung ,  Kwang Joo Lee ,  Minsu Jeong ,  Ju Hyeon Kim ,  Youngsam Kim

IPC: C09J163/00 ,  C08G59/30 ,  C08G59/32 ,  C08G77/14 ,  C08L33/20 ,  C08L63/00 ,  C08L83/06 ,  C09J7/00 ,  C09J7/10 ,  C09J7/30 ,  C09J11/00 ,  C09J11/04 ,  C09J11/06 ,  C09J133/20 ,  C09J183/06 ,  C09J183/12

CPC classification number: C09J163/00 ,  C09J11/04 ,  C09J11/06 ,  C09J183/06 ,  C09J2203/326

Abstract: The present disclosure relates to an adhesive composition for semiconductor circuit connection and an adhesive film containing the same. The adhesive composition for semiconductor circuit connection according to the present disclosure can exhibit excellent adhesive strength during thermal compression bonding of a semiconductor circuit, and minimize a warpage of wafer caused by stacking of semiconductor circuits.

公开(公告)号：US12286564B2

公开(公告)日：2025-04-29

申请号：US17266864

申请日：2020-05-08

Applicant: LG CHEM, LTD.

Inventor： Youngsam Kim ,  You Jin Kyung ,  Kwang Joo Lee ,  Minsu Jeong ,  Junghak Kim ,  Ju Hyeon Kim

IPC: C09J163/04 ,  C09J7/10 ,  C09J11/04 ,  C09J11/08 ,  H01L23/00

Abstract: The present disclosure relates to a resin composition for semiconductor adhesion comprising: a thermoplastic resin; a thermosetting resin; a curing agent; and a curing catalyst compound having a specific structure, and an adhesive film for semiconductor, a method for manufacturing a semiconductor package, and a semiconductor package using the same.

公开(公告)号：US12006308B2

公开(公告)日：2024-06-11

申请号：US17047551

申请日：2019-10-22

Applicant: LG CHEM, LTD.

Inventor： Youngsam Kim ,  Junghak Kim ,  Ju Hyeon Kim ,  Kwang Joo Lee

IPC: C07D403/12 ,  C09J7/30 ,  C09J11/06 ,  C09J163/00 ,  H01L23/00

CPC classification number: C07D403/12 ,  C09J7/30 ,  C09J11/06 ,  C09J163/00 ,  H01L24/29

Abstract: The present disclosure relates to a polymer compound having a specific structure, including an acrylic resin having a functional group capable of mutual hydrogen bonding with an acrylic resin having imidazole, a resin composition for bonding semiconductors including a thermoplastic resin; a thermosetting resin; a curing agent; and the polymer compound having a specific structure, and an adhesive film for semiconductor produced using the same.

公开(公告)号：US11834415B2

公开(公告)日：2023-12-05

申请号：US16769786

申请日：2019-04-17

Applicant: LG CHEM, LTD.

Inventor： Ju Hyeon Kim ,  Junghak Kim ,  Seunghee Nam ,  Kwang Joo Lee

IPC: C07D233/58 ,  C08J5/18 ,  C09J133/08 ,  C09J163/00 ,  C09J171/12 ,  H01L23/00

CPC classification number: C07D233/58 ,  C08J5/18 ,  C09J133/08 ,  C09J163/00 ,  C09J171/12 ,  H01L24/29 ,  C08J2333/08 ,  C08J2363/00 ,  C08J2371/12 ,  C08J2433/08 ,  C08J2463/00 ,  C08J2471/12 ,  H01L2224/2919 ,  H01L2924/066 ,  H01L2924/0665

Abstract: The present disclosure relates to an adhesive resin composition for bonding semiconductors, including: a thermoplastic resin; a thermosetting resin; a curing agent; and a compound having a specific structure, and an adhesive film for semiconductors including the same.