- 专利标题： Packages including multiple encapsulated substrate blocks and overlapping redistribution structures
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申请号： US17818742申请日： 2022-08-10
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公开(公告)号： US12027435B2公开(公告)日： 2024-07-02
- 发明人: Chen-Shien Chen , Kuo-Ching Hsu , Wei-Hung Lin , Hui-Min Huang , Ming-Da Cheng , Mirng-Ji Lii
- 申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Slater Matsil, LLP
- 分案原申请号： US17318703 2021.05.12
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L21/56 ; H01L23/00 ; H01L23/538
摘要：
A method includes forming a reconstructed package substrate, which includes placing a plurality of substrate blocks over a carrier, encapsulating the plurality of substrate blocks in an encapsulant, planarizing the encapsulant and the plurality of substrate blocks to reveal redistribution lines in the plurality of substrate blocks, and forming a redistribution structure overlapping both of the plurality of substrate blocks and encapsulant. A package component is bonded over the reconstructed package substrate.
公开/授权文献
- US20220384287A1 Packages with Multiple Encapsulated Substrate Blocks 公开/授权日：2022-12-01
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