- 专利标题: Solid-state imaging device
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申请号: US17393751申请日: 2021-08-04
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公开(公告)号: US12034016B2公开(公告)日: 2024-07-09
- 发明人: Masaki Funaki
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP 16185672 2016.09.23
- 主分类号: H01L27/146
- IPC分类号: H01L27/146 ; H04N23/745 ; H04N25/57 ; H04N25/585 ; H04N25/589 ; H04N25/65 ; H04N25/702 ; H04N25/75 ; H04N25/76 ; H04N25/771 ; H04N25/79 ; H01L23/38 ; H01L25/16 ; H01L31/024
摘要:
A first pixel circuit has a plurality of photodiodes of different sizes. A second pixel circuit is connected to the first pixel circuit, and has a holding portion that holds a first optical signal and a second optical signal. The peripheral circuit drives and controls the second pixel circuit, and determines whether a voltage value of the first optical signal is equal to or greater than a predetermined value. When it is determined that the voltage value of the first optical signal is equal to or greater than the predetermined value, a signal obtained by adding the second optical signal to the first optical signal is set as an output signal. When it is determined that the voltage value of the first optical signal is less than the predetermined value, the first optical signal is set as an output signal.
公开/授权文献
- US20210368090A1 SOLID-STATE IMAGING DEVICE 公开/授权日:2021-11-25
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