Invention Grant
- Patent Title: Multi-thermal CVD chambers with shared gas delivery and exhaust system
-
Application No.: US17218892Application Date: 2021-03-31
-
Publication No.: US12037701B2Publication Date: 2024-07-16
- Inventor: Zhiyuan Ye , Shu-Kwan Danny Lau , Brian H. Burrows , Lori Washington , Herman Diniz , Martin A. Hilkene , Richard O. Collins , Nyi O. Myo , Manish Hemkar , Schubert S. Chu
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: C30B25/14
- IPC: C30B25/14 ; C23C16/44 ; C23C16/455 ; C30B25/08 ; C30B25/10 ; H01L21/67
Abstract:
A method and apparatus for a process chamber for thermal processing is described herein. The process chamber is a dual process chamber and shares a chamber body. The chamber body includes a first and a second set of gas inject passages. The chamber body may also include a first and a second set of exhaust ports. The process chamber may have a shared gas panel and/or a shared exhaust conduit.
Public/Granted literature
- US20210324514A1 MULTI-THERMAL CVD CHAMBERS WITH SHARED GAS DELIVERY AND EXHAUST SYSTEM Public/Granted day:2021-10-21
Information query
IPC分类:
