Invention Grant
- Patent Title: Expandable thermal solution for laptops
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Application No.: US17368851Application Date: 2021-07-07
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Publication No.: US12061502B2Publication Date: 2024-08-13
- Inventor: Jeff Ku , Tin Poay Chuah , Howe Yin Loo , Chin Kung Goh , Yew San Lim , Cora Shih Wei Nien
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Viering, Jentschura & Partner mbB
- Agent Benjamin L. von Rueden
- Main IPC: G06F1/20
- IPC: G06F1/20 ; G06F1/16

Abstract:
According to the present disclosure, a laptop may be provided with a compartment including a moveable segment, an expandable heat exchanger with a movable section, and an expandable fan unit. The release of the movable segment of the compartment from a lower portion of the compartment produces an opening in the compartment and the movable section of the expandable heat exchanger is extended downward, and the expandable fan unit is lowered when the movable segment of the compartment is released.
Public/Granted literature
- US20210333848A1 EXPANDABLE THERMAL SOLUTION FOR LAPTOPS Public/Granted day:2021-10-28
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