- Patent Title: Highly integrated scalable, flexible DSP megamodule architecture
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Application No.: US17237391Application Date: 2021-04-22
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Publication No.: US12072812B2Publication Date: 2024-08-27
- Inventor: Timothy D. Anderson , Joseph Zbiciak , Duc Quang Bui , Abhijeet Chachad , Kai Chirca , Naveen Bhoria , Matthew D. Pierson , Daniel Wu , Ramakrishnan Venkatasubramanian
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Brian D. Graham; Frank D. Cimino
- The original application number of the division: US14331986 2014.07.15
- Main IPC: G06F9/30
- IPC: G06F9/30 ; G06F7/24 ; G06F7/487 ; G06F7/499 ; G06F7/53 ; G06F7/57 ; G06F9/32 ; G06F9/345 ; G06F9/38 ; G06F9/48 ; G06F11/00 ; G06F11/10 ; G06F12/0862 ; G06F12/0875 ; G06F12/0897 ; G06F12/1009 ; G06F12/1045 ; G06F17/16 ; H03H17/06 ; G06F15/78

Abstract:
Disclosed embodiments include an electronic device having a processor core, a memory, a register, and a data load unit to receive a plurality of data elements stored in the memory in response to an instruction. All of the data elements hare the same data size, which is specified by one or more coding bits. The data load unit includes an address generator to generate addresses corresponding to locations in the memory at which the data elements are located, and a formatting unit to format the data elements. The register is configured to store the formatted data elements, and the processor core is configured to receive the formatted data elements from the register.
Public/Granted literature
- US20210240634A1 HIGHLY INTEGRATED SCALABLE, FLEXIBLE DSP MEGAMODULE ARCHITECTURE Public/Granted day:2021-08-05
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