Invention Grant
- Patent Title: Substrate treating apparatus and substrate treating method
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Application No.: US17884709Application Date: 2022-08-10
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Publication No.: US12083551B2Publication Date: 2024-09-10
- Inventor: Sang Min Lee , Woo Jin Chung , Ki Bong Kim
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Cheonan-si
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20210106781 2021.08.12
- Main IPC: B05C11/10
- IPC: B05C11/10 ; B05C5/02 ; H01L21/67

Abstract:
The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a treating space; and a fluid supply unit supplying a treating fluid to the chamber, and wherein the fluid supply unit includes: a supply tank storing the treating fluid; a supply line connecting the supply tank and the chamber; and a plurality of valves installed at the supply line, and wherein any one valve among the plurality of valves is provided as a safety valve, and wherein the safety valve is opened after confirming that the chamber has been switched to a closed state when supplying the treating fluid from a tank to the chamber.
Public/Granted literature
- US20230046276A1 SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD Public/Granted day:2023-02-16
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