Invention Grant
- Patent Title: Infrared thermopile sensor
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Application No.: US17326289Application Date: 2021-05-20
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Publication No.: US12085451B2Publication Date: 2024-09-10
- Inventor: Wen-Chie Huang , Yu-Chih Liang , Chein-Hsun Wang , Ming Le , Chen-Tang Huang , Chein-Hsing Yu , Tung-Yang Lee , Jenping Ku
- Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.
- Applicant Address: TW Hsin-Chu
- Assignee: ORIENTAL SYSTEM TECHNOLOGY INC.
- Current Assignee: ORIENTAL SYSTEM TECHNOLOGY INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: HDLS IPR SERVICES
- Agent Chun-Ming Shih
- Priority: TW 0204389 2021.04.21
- Main IPC: G01J5/16
- IPC: G01J5/16 ; G01J5/04 ; G01J5/0806

Abstract:
An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.
Public/Granted literature
- US20220341789A1 INFRARED THERMOPILE SENSOR Public/Granted day:2022-10-27
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