TEMPERATURE SENSOR DEVICE FOR POWER DISTRIBUTION PANEL

    公开(公告)号:US20230349768A1

    公开(公告)日:2023-11-02

    申请号:US18308416

    申请日:2023-04-27

    CPC classification number: G01J5/10 G08B21/182 G01J2005/106

    Abstract: A temperature sensor device for a power distribution panel includes a Power over Ethernet (PoE) interface, a DC-to-DC step down converter, at least one infrared temperature sensor array, a microcontroller and a communication interface. The PoE interface is used to obtain a required power supply from the Ethernet network. The DC-to-DC step down converter steps down the power supply from a first voltage to a second voltage. The infrared temperature sensor array receives infrared rays radiated from a monitored area of the power distribution panel and generates a corresponding sensation signal. The microcontroller receives the sensation signal and generates an alert signal when the sensed temperature of the monitored area exceeds a preset threshold. The threshold can be dynamically adjusted according to time of day or day of months. The communication interface enables the communication between an external electronic device and the temperature sensor device for the power distribution panel.

    Chip-scale infrared emitter package
    3.
    发明授权
    Chip-scale infrared emitter package 有权
    芯片级红外发射器封装

    公开(公告)号:US08575578B1

    公开(公告)日:2013-11-05

    申请号:US13788757

    申请日:2013-03-07

    CPC classification number: G01N21/3504

    Abstract: A chip-scale infrared emitter package comprises an emitter chip and an enclosure. The emitter chip includes: a base having a central cavity; a membrane having a peripheral end, the peripheral end being isolated from a periphery of the central cavity by a loop-shaped gap; an electric resistor formed on the membrane; at least one slim supporting beam extending from the peripheral end of the membrane through the loop-shaped gap to the base; and a reflective material coated on the membrane. The enclosure has a can housing and a transparent window plate. The window plate cooperates with the can housing to define an enclosed vacuum chamber. The emitter chip is mounted in the enclosed vacuum chamber. The enclosed vacuum chamber has a pressure less than 0.01 torr.

    Abstract translation: 芯片级红外发射器封装包括发射极芯片和外壳。 发射极芯片包括:具有中心腔的基座; 具有外周端的膜,所述外周端通过环形间隙与所述中心腔的周边隔离; 形成在膜上的电阻器; 至少一个细长的支撑梁,从膜的周边端部延伸穿过环形间隙到基部; 和涂覆在膜上的反射材料。 外壳具有罐壳和透明窗板。 窗板与罐壳体配合以限定封闭的真空室。 发射极芯片安装在封闭的真空室中。 封闭的真空室的压力小于0.01乇。

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